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1

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting

Oppert, Thomas, Teutsch, Thorsten, Azdasht, Ghassem, Zakel, Elke

Year:

2012

Language:

english

File:

PDF, 15.19 MB

english, 2012

2

Initial assessment of the determination procedure for the lower explosion point under elevated pressures

Lucassen, Arnas, Beyer, Michael, Zakel, Sabine

Journal:

Journal of Loss Prevention in the Process Industries

Year:

2019

Language:

english

File:

PDF, 1.32 MB

english, 2019

3

Corrigendum: Fluorogen-activating single-chain antibodies for imaging cell surface proteins

Szent-Gyorgyi, Christopher, Schmidt, Brigitte A, Creeger, Yehuda, Fisher, Gregory W, Zakel, Kelly L, Adler, Sally, Fitzpatrick, James A J, Woolford, Carol A, Yan, Qi, Vasilev, Kalin V

Journal:

Nature Biotechnology

Year:

2008

Language:

english

File:

PDF, 51 KB

english, 2008

4

Fluorogen-activating single-chain antibodies for imaging cell surface proteins

Szent-Gyorgyi, Christopher, Schmidt, Brigitte A, Creeger, Yehuda, Fisher, Gregory W, Zakel, Kelly L, Adler, Sally, Fitzpatrick, James A J, Woolford, Carol A, Yan, Qi, Vasilev, Kalin V

Journal:

Nature Biotechnology

Year:

2007

Language:

english

File:

PDF, 429 KB

english, 2007

5

A new approach to chip size package using meniscus soldering and FPC-bonding

Kallmayer, C., Jung, E., Kasulke, P., Azadeh, R., Azdasht, G., Zakel, E., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part C

Year:

1998

Language:

english

File:

PDF, 892 KB

english, 1998

6

Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

Aschenbrenner, R., Ostmann, A., Motulla, G., Zakel, E., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part C

Year:

1997

Language:

english

File:

PDF, 176 KB

english, 1997

7

10.5 W Time-Averaged Power Mid-IR Supercontinuum Generation Extending Beyond 4 m With Direct Pulse Pattern Modulation

Chenan Xia, Zhao Xu, Islam, M.N., Terry, F.L., Freeman, M.J., Zakel, A., Mauricio, J.

Journal:

IEEE Journal of Selected Topics in Quantum Electronics

Year:

2009

Language:

english

File:

PDF, 1.05 MB

english, 2009

8

Imaging of Femoral Acetabular Impingement Syndrome

Manaster, B.J., Zakel, Sara

Journal:

Clinics in Sports Medicine

Year:

2006

Language:

english

File:

PDF, 794 KB

english, 2006

9

[IEEE 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Petaling Jaya, Malaysia (2007.11.8-2007.11.10)] 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Laser assisted soldering and Flip-Chip attach for 3-D packaging

Oppert, T., Azdasht, G., Zakel, E., Teutsch, T.

Year:

2006

Language:

english

File:

PDF, 110 KB

english, 2006

10

Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates

Kloeser, J., Zakel, E., Bechtold, F., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1996

Language:

english

File:

PDF, 1.94 MB

english, 1996

11

[IEEE Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe. Electronics Manufacturing and Development for Automotives - Berlin, Germany (27-29 April 1998)] Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) - Solder ball bumper SB/sup 2/-a flexible manufacturing tool for 3-dimensional sensor and microsystem packages

Kasulke, P., Schmidt, W., Titerle, L., Bohnaker, H., Oppert, T., Zakel, E.

Year:

1998

Language:

english

File:

PDF, 680 KB

english, 1998

12

Mounting of high power laser diodes on diamond heatsinks

Weiss, S., Zakel, E., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1996

Language:

english

File:

PDF, 879 KB

english, 1996

13

Reliability and Au-concentration in OLB solder fillets of TAB-devices having a 75 μm pitch

Zakel, E., Villain, J., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1996

Language:

english

File:

PDF, 2.35 MB

english, 1996

14

Degradation of TAB outer lead contacts due to the Au-concentration in eutectic tin/lead solder

Zakel, E., Azdasht, G., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 922 KB

english, 1994

15

Reliability investigations of different tape metallizations for TAB-outer lead bonding

Zakel, E., Azdasht, G., Kruppa, P., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 950 KB

english, 1994

16

Charge Transfer across the Interface between LiNi0.5Mn1.5O4 High-Voltage Cathode Films and Solid Electrolyte Films

Gellert, M., Gries, K. I., Zakel, J., Kranz, S., Bradler, S., Hornberger, E., Muller, S., Yada, C., Rosciano, F., Volz, K., Roling, B.

Journal:

Journal of The Electrochemical Society

Year:

2015

Language:

english

File:

PDF, 1.99 MB

english, 2015

17

Low Energy Ion Scattering (LEIS). A Practical Introduction to its Theory, Instrumentation, and Applications.

Cushman, Cody V., Brüner, Philipp, Zakel, Julia, Major, George I, Lunt, Barry M, Grehl, Thomas, Smith, Nicholas J, Linford, Matthew

Journal:

Analytical Methods

Year:

2016

Language:

english

File:

PDF, 5.19 MB

english, 2016

18

Gold‐Tin Solder Bumps for TAB Inner Lead Bonding with Reduced Bonding Pressure

Zakel, E., Simon, J., Azdasht, G., Reichl, H.

Journal:

Soldering & Surface Mount Technology

Year:

1992

Language:

english

File:

PDF, 417 KB

english, 1992

19

Individual RD1-region genes are required for export of ESAT-6/CFP-10 and for virulence of Mycobacterium tuberculosis

Kristi M. Guinn, Mark J. Hickey, Sanjeev K. Mathur, Kelly L. Zakel, Jeff E. Grotzke, David M. Lewinsohn, Sherilyn Smith, David R. Sherman

Journal:

Molecular Microbiology

Year:

2004

Language:

english

File:

PDF, 371 KB

english, 2004

20

Measuring summer patterns of ascospore release by saltmarsh fungi

Steven Y. Newell, Kelly L. Zakel

Journal:

Year:

2000

Language:

english

File:

PDF, 515 KB

english, 2000

21

Periphere analgetische Wirkung durch intraartikulär verabreichtes Clonidin

A. Sadjak, R. Wintersteiger, D. Zakel, T. Wenzl, E. P. Lankmayr, E. Gferer, R. Likar

Journal:

Year:

2006

Language:

german

File:

PDF, 691 KB

german, 2006

22

Positive selection system to screen for inhibitors of human immunodeficiency virus-1 transcription

Rosario, Merci Del, Stephans, James C., Zakel, Joan, Escobedo, Jaime, Giese, Klaus

Journal:

Nature Biotechnology

Year:

1996

File:

PDF, 722 KB

1996

23

Investigations of laser soldered TAB inner lead contacts

Zakel, E., Azdasht, G., Reichl, H.

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1991

Language:

english

File:

PDF, 1.17 MB

english, 1991

24

Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn

Zakel, E., Reichl, H.

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1993

Language:

english

File:

PDF, 1.16 MB

english, 1993

25

Temperature and Pulse-Duration Dependence of Second-Harmonic Generation in CdGeAs_2

Zakel, Andrew, Blackshire, James L., Schunemann, Peter G., Setzler, Scott D., Goldstein, Jonathan, Guha, Shekhar

Journal:

Year:

2002

Language:

english

File:

PDF, 160 KB

english, 2002

26

Determination and quantification of clonidine in human blood serum

Thomas Wenzl, Ernst P Lankmayr, Reinhold Wintersteiger, Anton Sadjak, Rudolf Likar, Dieter Zakel

Journal:

Journal of Biochemical and Biophysical Methods

Year:

2002

Language:

english

File:

PDF, 141 KB

english, 2002

27

Transesophageal echocardiographic assessment of right heart hemodynamics during high-frequency jet ventilation

Gerald Ihra, Nikolai Kolev, Dieter Zakel, Anton Kepka, Christa Schabernig, Alexander Aloy

Journal:

Journal of Clinical Anesthesia

Year:

1999

Language:

english

File:

PDF, 134 KB

english, 1999

28

Investigations of failure mechanisms of TAB-bonded chips during thermal aging

Zakel, E., Reichl, H.

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1990

Language:

english

File:

PDF, 1.39 MB

english, 1990

29

Potassium ion transport through poly-para-xylylene films

Schulze, S., Zakel, J., Schafer, M., Weitzel, K.-M.

Journal:

IEEE Transactions on Dielectrics and Electrical Insulation

Year:

2012

Language:

english

File:

PDF, 416 KB

english, 2012

30

Metalloproteins – a new challenge for metrology

Swart, Claudia, Fisicaro, Paola, Goenaga-Infante, Heidi, Zakel, Sabine

Journal:

Year:

2012

Language:

english

File:

PDF, 1.30 MB

english, 2012

31

Reference measurement procedures for the iron saturation in human transferrin based on IDMS and Raman scattering

Frank, Claudia, Rienitz, Olaf, Jährling, Reinhard, Schiel, Detlef, Zakel, Sabine

Journal:

Year:

2012

Language:

english

File:

PDF, 2.84 MB

english, 2012

32

[IEEE Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting - San Francisco, CA, USA (10-13 Nov. 1997)] Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting - Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder

Weiss, S., Kaulfersch, E., Topfer, M., Zakel, E., Michel, B., Reichl, H.

Year:

1996

Language:

english

File:

PDF, 234 KB

english, 1996

33

[IEEE Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (14-16 Oct. 1996)] Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Self-aligning flip-chip assembly using eutectic gold/tin solder in different atmospheres

Kallmayer, C., Oppermann, H., Eugelmann, G., Zakel, E., Reichl, H.

Year:

1996

Language:

english

File:

PDF, 1.25 MB

english, 1996

34

LiNi0.5Mn1.5O4 Thin-Film Cathodes on Gold-Coated Stainless Steel Substrates: Formation of Interlayers and Electrochemical Properties

Gellert, Michael, Gries, Katharina I., Zakel, Julia, Ott, Andrea, Spannenberger, Stefan, Yada, Chihiro, Rosciano, Fabio, Volz, Kerstin, Roling, Bernhard

Journal:

Electrochimica Acta

Year:

2014

Language:

english

File:

PDF, 1.92 MB

english, 2014

35

Investigation of sodium ion depletion layers in electrothermally poled bioglasses by combining impedance spectroscopy with ToF-SIMS depth profiling

Zakel, Julia, Heddinga, Vivane, Steinmüller, Sven Ole, Roling, Bernhard

Journal:

Solid State Ionics

Year:

2013

Language:

english

File:

PDF, 462 KB

english, 2013

36

Characterization of ZnO structures by optical and X-ray methods

Petrik, P., Pollakowski, B., Zakel, S., Gumprecht, T., Beckhoff, B., Lemberger, M., Labadi, Z., Baji, Z., Jank, M., Nutsch, A.

Journal:

Applied Surface Science

Year:

2013

Language:

english

File:

PDF, 1.21 MB

english, 2013

37

Terahertz Absorption of Nematic Liquid Crystals

Vieweg, Nico, Celik, Mehmet Ali, Zakel, Sabine, Gupta, Vineet, Frenking, Gernot, Koch, Martin

Journal:

Journal of Infrared, Millimeter and Terahertz Waves

Year:

2014

Language:

english

File:

PDF, 411 KB

english, 2014

38

Low energy bombardment induced cesium ion transport through a sodium ion conductor: Concentration profiles and diffusion coefficients

Zakel, Julia, Menezes, Pramod V., Schäfer, Martin, Weitzel, Karl-Michael

Journal:

Solid State Ionics

Year:

2013

Language:

english

File:

PDF, 636 KB

english, 2013

39

On the mechanism of field-induced mixed ionic–electronic transport during electro-thermal poling of a bioactive sodium–calcium phosphosilicate glass

Zakel, Julia, Balabajew, Marco, Roling, Bernhard

Journal:

Solid State Ionics

Year:

2014

Language:

english

File:

PDF, 1.04 MB

english, 2014

40

[IEEE Japan International Electronic Manufacturing Technology Symposium - Kanazawa, Japan (June 9-11, 1993)] Proceedings of Japan International Electronic Manufacturing Technology Symposium - Degradation Of Tab Outer Lead Contacts Due To The Au Concentration In Eutectic Tin/lead Solder

Zakel, E., Azdasht, G., Reich, H.

Year:

1993

Language:

english

File:

PDF, 970 KB

english, 1993

41

Mycobacterium tuberculosis H37Rv:ΔRD1 Is More Virulent than M. bovis Bacille Calmette‐Guérin in Long‐Term Murine Infection

Sherman, David R., Guinn, Kristi M., Hickey, Mark J., Mathur, Sanjeev K., Zakel, Kelly L., Smith, Sherilyn

Journal:

The Journal of Infectious Diseases

Year:

2004

Language:

english

File:

PDF, 331 KB

english, 2004

42

[IEEE Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' - Austin, TX, USA (2-4 Oct. 1995)] Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' - Fluxless flip-chip attachment techniques using the Au/Sn metallurgy

Kallmayer, C., Lin, D., Kloeser, J., Oppermann, H., Zakel, E., Reichl, H.

Year:

1995

Language:

english

File:

PDF, 1.94 MB

english, 1995

43

[IEEE Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Windsor, England (8-10 June 1994)] Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Flip chip attach of GaAs devices using ball bump technology

Eldring, J., Zakel, E., Reichl, H.

Year:

1994

Language:

english

File:

PDF, 258 KB

english, 1994

44

[IEEE Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (14-16 Oct. 1996)] Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Reliability investigations of different bumping processes for flip chip and TAB applications

Jung, E., Kloeser, J., Nave, J., Engelmann, G., Dietrich, L., Zakel, E., Reichl, H.

Year:

1996

Language:

english

File:

PDF, 748 KB

english, 1996

45

[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - A reliable thermosonic wire bond of GaAs-devices analysed by infrared-microscopy

Weiss, S., Zakel, E., Reichl, H.

Year:

1994

Language:

english

File:

PDF, 900 KB

english, 1994

46

Double isotope dilution surface-enhanced Raman scattering as a reference procedure for the quantification of biomarkers in human serum

Zakel, Sabine, Rienitz, Olaf, Güttler, Bernd, Stosch, Rainer

Journal:

The Analyst (Royal Society of Chemistry)

Year:

2011

Language:

english

File:

PDF, 248 KB

english, 2011

47

[IEEE Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe. Electronics Manufacturing and Development for Automotives - Berlin, Germany (27-29 April 1998)] Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) - A roadmap to low cost bumping for DCA, COF, CSP and BGA [flip chip]

Zakel, E., Teutsch, T.

Year:

1998

Language:

english

File:

PDF, 726 KB

english, 1998

48

[IEEE Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (18-19 Oct. 1999)] Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) - A bumping process for 12" wafers

Oppert, T., Teutsch, T., Zakel, E., Tovar, D.

Year:

1999

Language:

english

File:

PDF, 580 KB

english, 1999

49

[Organizing Committee 1998 IEMT/IMC Symposium 2nd 1998 IEMT/IMC Symposium - Tokyo, Japan (15-17 April 1998)] 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) - A roadmap to low cost flip chip and CSP using electroless Ni/Au

Oppert, T., Zakel, E., Teutsch, T.

Year:

1998

Language:

english

File:

PDF, 1.10 MB

english, 1998

50

[IEEE 2010 International Symposium on Advanced Packaging Materials: Microtech (APM) - Cambridge, United Kingdom (2010.02.28-2010.03.2)] 2010 International Symposium on Advanced Packaging Materials: Microtech (APM) - WLCSP and flipchip production using electroless NI/AU plating and wafer level solder sphere transfer technologies

Year:

2010

Language:

english

File:

PDF, 2.68 MB

english, 2010

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